When the processor is well soldered to ihs, it is best not to remove it. Heat is easier to extract using a larger surface. It is better to polish the ihs to improve the contact.

As for the current capacity to cool 250w, it all depends on what you mean by "easily" cooling.

For a cpu under burn at 70°, something really effective should make a delta of 10-20° (max) with water. Something like 50-60°

Water out of waterblock, pipes and radiator(s) must be hot, let's see the current heat transfer waterblocks:



The hotter the water (of course keeping a minimum flow) the higher the performance. With 36.5 ° as delta for the best, there is still a lot of room for a real performance evolution!

One must think about transferring the heat throughout the block before looking for a way to cool it.

Just as the cpu must be welded to the IHS, the top and bottom parts of the waterblock should be "welded".

As we have to open it to clean it, it's impossible to have a block in one block. The research should be articulated in this direction.

Please develop, I have a doubt about the meaning of the question.

You think it's the sensor that does not give the right result? This is possible to some extent, but let's not forget that the gpu contact surface is much larger than the CPU surface.

The best would be the waterblock directly soldered to the dies. No ihs, no thermal paste ...

I think Intel is forced to compete with Amd, increase the number of cores and thus restart a solder dies at IHS.

We can therefore expect to have to dissipate a large heated surface homogeneously.

It suits us well but will surely completely change the situation regarding the best waterblock.

Now the 4 dies will be used in AMD threadripper2 (2990x 32/64) the temperature will be distributed more homogeneously to the IHS (maximizing center cooling will not be the most efficient) :



A manufacturer has already developed something that I find good and that should work well on the processors in general (although the shape is rectangular, I think we can make a slot longer than what is already done for a "square" waterblock.), I let you judge:





Intel will be forced to solder also to catch up, a lot of power not mastered by the process of engraving (but this is only my opinion).

@gr3if

As expected Intel ihs are again soldered

They did it quickly to win a short victory, the 7nm arriving soon at AMD, they will have to quickly find thermal solutions to continue the race ...

As you can see it takes a big watercooling to get the best of the 9900 and 9700k which heats up enormously and it will get worse ...

It will be time to create new waterblock designs